.Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.Advance Packaging Technology Development Engineer (ATPDE)JOB DESCRIPTION:Micron's Assembly Package Development Team is looking for a motivated and experienced individual contributor for this position in Process Development team. A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron's memory products from pathfinding through NPI start up including side by side certification with Manufacturing teams. Assessing processes by knowledge and skills, taking measurements and interpreting data are everyday responsibilities and expectations for the successful candidate. Other deliverables in this job function are Assembly design rules development working closely with Design teams (Globally) and you will be involved in the design approvals (substrate and silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board). An importance of this role is pathfinding of innovative package technology: Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies. Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus. Finally, hands on integration experience in Package Assembly and Wafer Level package process are needed. Other responsibilities may include conducting supplier interactions/meetings and drive NDAs for new projects, which all together requires a significant understanding of the processes, first principles and process control systems.JOB REQUIREMENTExperience:Experience: More than 7 years experience in semiconductor manufacturing or a related field, with hands-on experience in Semiconductor Packaging or Fab Frontend processes. Experience with HBM (High Bandwidth Memory) or Advanced Packaging integration is a plus.Education: Bachelor degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field. PhD / Masters Degree is preferred.Technical Experience: Development experience in one or more areas of Photo, PVD, CVD, CMP, wafer level molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bond.Problem-Solving Abilities: Strong analytical and problem-solving skills, with the ability to troubleshoot issues and optimize process parameters.Communication Skills: Fluent in English. Effective verbal and written communication skills, with the ability to communicate clearly and professionally with global team members and stakeholders