Job Title: Advance Packaging Technology Development Engineer (ATPDE)Micron's Assembly Package Development Team is looking for a motivated and experienced individual contributor for this position in Process Development team.
A good candidate will be developing, configuring and optimizing Package Assembly processes (front end, bonding and back end) for Micron's memory products from pathfinding through NPI start up including side by side certification with Manufacturing teams.The successful candidate will be assessing processes by knowledge and skills, taking measurements and interpreting data on an everyday basis.
Other deliverables in this job function are Assembly design rules development working closely with Design teams (Globally) and you will be involved in the design approvals (substrate and silicon), running, testing and upgrading systems and processes, approving the materials, process and equipment changes in the CCB (change control board).An important aspect of this role is pathfinding of innovative package technology: Deep fundamental understanding of the key risks in Bumping, Flip chip and HBM technologies.
Actual experience with TCB (Thermal Compression Bonding), CMP (Chemical Mechanical Polish), and Ball Mount is a plus.
Finally, hands on integration experience in Package Assembly and Wafer Level package process are needed.Job RequirementsAt least 7 years of experience in semiconductor manufacturing or a related field, with hands-on experience in Semiconductor Packaging or Fab Frontend processes.
Experience with HBM (High Bandwidth Memory) or Advanced Packaging integration is a plus.Bachelor degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics or related field.
PhD / Masters Degree is preferredDevelopment experience in one or more areas of Photo, PVD, CVD, CMP, wafer level molding, wafer level ball mount, TCB, FC, UF, Hybrid bond, Glass carrier bond/ de-bondStrong analytical and problem-solving skills, with the ability to troubleshoot issues and optimize process parametersFluent in English.
Effective verbal and written communication skills, with the ability to communicate clearly and professionally with global team members and stakeholdersAbility to work effectively in a fast-paced and dynamic environment, with the flexibility to work with global teams across different time zonesCollaborative mindset with a willingness to work closely with cross-functional teams to achieve common goals.Salary:$143,456 - $173,542 per yearWe offer a competitive salary based on your experience and qualifications.