.The semiconductor industry follows a steady and incessant trend of volume reduction and compact component placement, resulting in unprecedent thermo-mechanical challenges to dissipate the increased power associated to higher performance.As members of our Platform Hardware Engineering Division, mechanical, thermal and system engineers work in close collaboration with multiple disciplines in different geos to develop novel thermo-mechanical solutions for the next generation of high-end microprocessors and systems.In TMS (Thermal Mechanical Solutions), you will also design reference platforms and systems to validate microprocessors/chipsets to ensure world-class quality and reliable Intel products for our customers.**The Mechanical Engineer will be responsible for**:- Designing and analyzing mechanical systems, equipment, and packaging- Conducting feasibility studies and testing on new and modified designs, will direct support personnel in the preparation of detailed design, design testing and prototype fabrication- Providing design information to drafting for packaging documentation- Resilience**Qualifications**:Experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences.**Minimum Qualifications**:- 5+ years of experience in mechanical design- Advanced English level**Preferred Qualifications**:- Experience using Pro/E Creo, Solid works, or other parametric CAD- Experience with engineering design and analysis tools- Experience with mechanical hardware development life cycle- Experience with manufacturing processes including CNC, sheet metal, 3D Printing, and injection molding- Modeling, Assembly, Detailing, Sheet Metal, Mechanical experience- FMEA and risk matrix tools experience- Knowledge of Geometric Dimensioning and Tolerancing- Knowledge of PDM tools such as Windchill- Knowledge and experience in component and platform/systems- Design of Experiments (DoE)- Finite Element Analysis (FEA).- Professional experience in mechanical design- Use of Pro/E Creo, Solid works, or other parametric CAD- Knowledge of manufacturing processes including CNC, sheet metal, 3D Printing, and injection molding**Inside this Business Group**:The Data Center & Artificial Intelligence Group (DCAI) is at the heart of Intel's transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world