Plating Process Engineer

Descripción y detalle de las actividades1. Research and implementation of new plating processes. 2. Monitor and improve throughput, quality, yield, and uptime of wafer plating equipment/processes. 3. Continuous improvement of process plating line 4. Establish analysis frequencies, chemistry bath life, and maintenance schedules and execute. statistical process control on a fully automated wafer plating equipment. 5. Update and maintain documentation of wafer plating processes. 6. Facilitate necessary experiments (DOE format) to troubleshoot quality issues. 7. Deliver products which conform to IPC thickness specifications.Experiência y requisitos**Número de vacantes** 1**Área** Ingeniería**Contrato** Permanente**Modalidad** Presencial**Turno** Diurno**Jornada** Tiempo Completo**Estudios** Carrera Profesional**Sexo** Indistinto**Disponibilidad p. viajar** No