North American Production Sharing - Tijuana, MexicoSalary: NegotiableEmployment Type: Full-TimePositions Available: 1Job DescriptionAdditional responsibilities:IC top level floor planning including hard macro block placement, padring, RDL and bump pattern/assignmentSystem level co-design methodology of IC, Package and PCB/BoardConcept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level costPackage design flow methodology implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specsPackage design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization techniques at the die/pkg/PCB levelsWorking with marketing/IC/product teams on competitive analysis and road mapping package technology for future productsMinimum Qualifications:Bachelor's degree in Engineering, Information Systems, Computer Science, or related field.2+ years Hardware Engineering experience or related work experience.Preferred Qualifications:Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysisStrong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theoryExperience in IC package, SIP module and/or PCB selection, design and layout.Experience in Pinmap optimization of optimal package, SIP module and/or PCB designsExperience in IC, package, PCB co-design for system performance optimization.Hands on experience with Cadence SIP and/or Mentor Xpedition.Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.Familiar with assembly and substrate manufacturing process is a plusEducation RequirementsBachelor's in Electrical Engineering and/or Mechanical Engineering.Preferred: Master's in Electrical Engineering.
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