.Red Cell Partners is an incubation firm building and investing in rapidly scalable technology-led companies that are bringing revolutionary advancements to market in three distinct practice areas: healthcare, cyber, and national security.
United by a shared sense of duty and deep belief in the power of innovation, Red Cell is developing powerful tools and solutions to address our Nation's most pressing problems.About ClarosClaros innovates at the intersection of power and compute.
We build advanced semiconductor power management solutions that improve AI compute capacity, efficiency and reliability.Claros is an early-stage startup company located in Torrance, CA.
If you are looking for challenging work and a strong technical environment with a collaborative & supportive culture, then Claros Tech is the company for you.
We offer industry best competitive pay & benefits and early-stage stock options.Location: Minimum of 3 days a week in the office in Torrance, CA.About the Team:We are open-minded, fast-paced problem solvers that value open dialogue and candor.
Our passion is to challenge the status-quo and we embrace transformational thinking.
Our response is never 'no, but…' instead 'yes, if….' We are mindful of our personal and organizational blinders and try to build an environment where our team members are At Their Best.This role will report to: Vice President of EngineeringRole Description:Claros Inc. is seeking to hire an exceptional Senior Packaging Engineer to join our team in Torrance, CA.
The candidate must be a self-motivated individual who will work closely with silicon & package design, marketing, NPI, assembly/substrate suppliers & customers and is responsible for developing cost-effective high-performance, advanced custom package solutions achieving signal integrity, thermal, structural reliability, substrate fab/package assembly design rules & project schedule requirements.Responsibilities:Provide deep expertise in 2.5D / 3D technology; current and future customer engagement on technology needs & updates, consolidation of requirements and drive towards unified solution.Lead in identification, development & qualification; program management withexternal assembly partners.Lead in power supplier(s) engagement to define technology and quality requirements.Interface with other technical teams (DI, Pkg Design, Test Dev) as part of Cross Functional Team.Support new design wins, NPI and volume ramps.Required Qualifications:4-6 years hands-on experience in 2.5D / 3D Development; in-depth know-how of advanced silicon fab, bump, interposer, substrate & assembly processes, materials & supplier selection, BOM definition, thermal and mechanical interactions.Hands-on experience with modeling (thermal & mechanical) & sub/PCB design CAD tools (APD, AutoCAD, Solidworks, etc.)
for design optimization