**Test Engineering Mgmt 2****Education**:- Communications and electronics engineer- Electronics engineer- Physics engineer- Materials engineer**Experience**:- 3 years of research experience on semiconductor device fabrication.- 3 year of electronics devices failure analysis.- 2 years of research experience on laser diodes, fiber lasers and optical elements.- 1 year of teaching experience on technical courses.**Knowledge (any of these)**:- Semiconductor Device Fabrication- 2D materials (graphene, MoS2, PtTe2) based FET and memristor device fabrication- Photomask design (layout editor), mask aligner (SUSS MicroTec MJB4 & EVG 620)- E-beam lithography (NPGS SEM)- E-beam Evaporation (Temescal, AJA and Thermionics evaporator) for metal deposition- Atomic layer deposition (Ultratech Savannah S200) for gate dielectric deposition- Dry etch (Plasma-Therm 790 RIE & Plasma-etch PE 50) for SiO2 and 2D materials etching- Wedge gold bonding for packaging- Material and electrical Characterization Techniques (3 years of experience)- Surface profiling of 2D materials by AFM (Anasys Instruments NanoIR2), SEM imaging of 2D material (Zeiss ultra-55 SEM), Raman and photoluminescence spectroscopy of 2D material, Profilometry.- DC & pulse current-voltage (I-V) measurement, using Keysight B1500A and HP 4156A- Capacitance-voltage (CV) & Capacitance-time (C-t) measurement using Keysight B1500A.- Beam and laser characterization (2 years of experience)- Mode characterization of a laser by razor blade technique- Light coupling using fiber optics- Laser diode characterization by polarization filter and varying temperature- Second harmonic generation by using Nd:YAG crystals and coupling to a lens objective- Engineering Analytical Tools**Skills**:- Analytical approach- Organized- Problem solving approach- Systemic thinking**Responsibilities**:- Lead and support the failure analysis groups in the region in critical analyzes to expedite the disposition of bone pile units.- Support the definition and participate on cases related to customer design issues or quality problems with component's suppliers to mitigate liability risks for Sanmina.